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The process of conducting silicon film and the principle of heat conduction are introduced

Article Source: Shenzhen Union Tenda Technology Co., LtdPopularity:365issuing time:2017-09-02smallinBig

Thermal cooling material used for traditional metal such as: Ag, Cu, A1, A12O3, MgO, metal oxides such as BeO and other non-metallic materials such as graphite, carbon black, but with the development of science and technology, people put forward new requirements for thermal materials, hope that the material with excellent comprehensive performance. In electric field due to the rapid development of the integrated technology and assembly technology, electronic components and logic circuit of the volume reduced to thousands upon thousands of times, higher thermal conductivity of insulating materials to solve the problem of heat dissipation. In recent decades, the application of polymer materials has been expanding, and the use of synthetic polymers instead of metal materials used in traditional industries has become one of the directions of scientific research in the world.
First, what are the heat conductive silica gel slices made from?
The silica based material, adding certain metal oxides and heat conduction through the synthesis of conducting auxiliary, special process of silica gel sheet. Thermally conductive silica gel is a kind of polymer composite heat conducting material with organosilicon resin as bonding material and heat conductive powder to achieve heat conduction
Two。 The common substrates and accessories used in the production of silica gel plates
Silicone resin (basic raw material)
1。 thermal insulation material powder: Magnesium Oxide, aluminum oxide, boron nitride, aluminum nitride, beryllium oxide, quartz and other organic plasticizer
2. flame retardant: magnesium hydroxide, aluminum hydroxide
3。 inorganic colorant (used to fill a product with a specific color)
4. cross linking agent (to make the product slightly sticky)
5. catalysts (process forming requirements)
Note: the heat conducting silica gel plate acts as a heat conducting device, and a good heat conducting passage is formed between the heating element and the heat dissipating device, and the gap can be filled
Fillers include the following metals and inorganic fillers:
1。 metal powder filler: copper。 Aluminium。 Iron powder。 Tin nickel powder and so on;
2. metal oxide: alumina. Bismuth oxide. Beryllium oxide. Magnesium Oxide Zinc Oxide;
3。 metal nitrides: aluminium nitride, boron nitride, silicon nitride;
4。 inorganic non-metallic: graphite, silicon carbide, carbon fiber, carbon nanotube, graphene, beryllium carbide, etc。
Three. Conductive silica gel can be divided into heat conductive silica gel and non silicon silicon film
The insulation performance of most heat conducting silicon films is determined by the insulation properties of filler particles.
1 、 thermal conductive silicone gasket
The thermal conductivity silica gel slice is divided into many small classes according to the thermal conductivity of the product and the surface feeding, no one has its own different characteristics
2, non silicone silicone gasket
Non silicone silicone gasket is a high thermal conductivity material, double sided self-adhesive, in the assembly of electronic components, low compression force shows lower thermal resistance and better electrical insulation characteristics. It can work stably at -40 and ~150 degrees centigrade. Meet the flame retardant grade requirements of UL94V0
Four: the principle of conductive silicon film
General idea: the thermal conductivity of the heat conducting silicon film depends on the interaction between the polymer and the thermal conductive filler. Different kinds of fillers have different heat conduction mechanisms
Thermal conduction mechanism of 1. metal filler
The heat conduction of metal packing mainly depends on the movement of electrons, and the corresponding heat is transmitted in the course of the movement of electrons

2. thermal conduction mechanism of non-metallic filler
The heat conduction of nonmetallic fillers mainly depends on phonon conduction, and the heat diffusion rate depends mainly on the vibration of neighboring atoms or binding groups. Including metal oxides, carbides and nitrides-

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