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Conductive gel/silicone/silico

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  • Thermal conductive silicon

Thermal conductive silicon

Category:Conductive gel/silicone/silico

Introduction:LC1001 is the semi-flowing heat-resistant silicone adhesive sealant which is made of special silicone rubber material the addition of thermal powders.With excellent conductivity,V0 flame retardant grade, excellent temperature resistance, can be in the range of 60 ~ 280 ℃ Long-term use.As well as good adhesion, long term use will not fall off, will not produce Contact gap to reduce thermal conductivity, moisture-proo...

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Product Feature:

LC1001 is the semi-flowing heat-resistant silicone adhesive sealant which is made of special silicone rubber material the addition of thermal powders.With excellent conductivity,V0 flame retardant grade, excellent temperature resistance, can be in the range of 60 ~ 280 ℃ Long-term use.As well as good adhesion, long term use will not fall off, will not produce Contact gap to reduce thermal conductivity, moisture-proof, anti-seismic, anti-corona, anti-leakage and aging The properties are widely used for the adhesion and sealing of the electronic components with high thermal conductivity, which is a single part of the acetone oxime type, It can be cured silicone rubber and conforms to the requirements of ROHS REACH UL


Typical Application:

High power LED lamps and lanterns, electrical power, microwave oven, electronic components and other industrial products of thermal conductive adhesive sealing, alternative thermal conductive silicone used in high-power electric module and radiator thermal conductivity between fixed filling adhesive, no card buckle screw, more reliable filling heat, simple process and lower cost.


Application method:


1. Surface clean : Clean the surface of the adhesive object and remove the rust, dust and oil.

2. Sizing: Twist the cap of the hose, squeeze the gel into the clean surface, and make it natural.

3. Curing: Place the bonded or sealed parts in the air while them to solidify naturally.Curing is a process from surface to the internal, within 24 hours (at room temperature and 55% relative humidity) will cure the depth of the 2 ~ 4 mm, if the site location is deeper that completely curing time will be postpone, especially it is not easy to come into contact with air. if the temperature is low, cure time also will be postpone.Prior to further processing or wrapping the bonded parts, it is recommended that the user wait long enough to ensure that the adhesion and integrity of the adhesion are not affected.



Note:

After the operation is completed, the unused glue should be tightened immediately and sealed.When used again, if the seal has a little bit of skin, remove it.In the process of storage, a small amount of curing phenomenon may occur in the pipe mouth, which can be used normally unaffected the product performance.


Physical Parameter:

性能指标

Performance Evaluation

LC1001

固化前

Uncured

外观 Appearance

白色、半流淌 White, Semiliquid

相对密度Relative Density

g/cm3

1.61.65

粘度 Adhesioncps

8000090000

表干时间 TFT minmin

≤10

完全固化时间Curing Timed

37

固化类型Curing Type

单组份脱乙醇型One group of deethanol

 

Cured

抗拉强度

Tensile StrengthMPa

≥1.5

扯断伸长率Elongation at Break

%

200400

硬度HardnessShore A

3545

剪切强度Shear StrengthMPa

≥1。0

剥离强度Peel StrengthN/mm

≥5

线性收缩率Linear Shrinkage%

≤0.5

Conductivity (W/m·K)

≥1.2

体积电阻率 Voltage Resistivity (Ω·cm)

3×1015

介电强度Dielectric strength (kV/·mm)

20

介电常数Permittivity (1.2MHz)

2。8

































Note:The data are checkout after curing 7 days,at 25 ℃, relative humidity 55% . We will not undertake responsibility for the different data from different test conditions or product improvement.

Packing Specification:

100ML/ 100PCS/Carton、300ML/ 25PCS/Carton2。6L/4PCS/Carton


Storage:

1。 This product should be below 35 ℃ storage in cool and dry environment, below 25 ℃ storage period is 1 year。


Physical Parameter:

性能指标

Performance Evaluation

LC1001

固化前

Uncured

外观 Appearance

白色、半流淌 White, Semiliquid

相对密度Relative Density

g/cm3

1。61。65

粘度 Adhesioncps

8000090000

表干时间 TFT minmin

≤10

完全固化时间Curing Timed

37

固化类型Curing Type

单组份脱乙醇型One group of deethanol

 

Cured

抗拉强度

Tensile StrengthMPa

≥1。5

扯断伸长率Elongation at Break

%

200400

硬度HardnessShore A

3545

剪切强度Shear StrengthMPa

≥1。0

剥离强度Peel StrengthN/mm

≥5

线性收缩率Linear Shrinkage%

≤0.5

    Conductivity (W/m·K)

≥1.2

体积电阻率 Voltage Resistivity (Ω·cm)

3×1015

介电强度Dielectric strength (kV/·mm)

20

介电常数Permittivity (1.2MHz)

2。8

































Note:The data are checkout after curing 7 days,at 25 ℃, relative humidity 55% . We will not undertake responsibility for the different data from different test conditions or product improvement.

Packing Specification:

100ML/ 100PCS/Carton、300ML/ 25PCS/Carton2.6L/4PCS/Carton


Storage:

1。 This product should be below 35 ℃ storage in cool and dry environment, below 25 ℃ storage period is 1 year。

order:Thermal conductive silicon

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